Electron Microscopy
Transmission Electron Microscopes
FEI Titan Themis³ 300
The Titan Themis3 300 is one of our two high-end TEM providing high-resolution imaging as well as high performance analytical investigation capabilities. This double-aberration-corrected TEM corrects both the image and the probe forming system enabling high-resolution imaging in TEM as well as scanning TEM (STEM) mode resulting in resolution limits below 1 Å for both modes for all high tensions between 60 kV and 300 kV. The high brightness electron gun (X-FEG) equipped with a monochromator to improve the energy resolution in combination with a high-sensitivity SDD X-ray spectrometer (Super-X) and a high-resolution post-column energy filter (GIF Quantum) creates a high performance analytical instrument perfectly suited for the nanoanalytical characterization of all kinds of materials and devices. Energy filtered TEM (EFTEM) imaging, high-resolution electron energy-loss spectroscopy (EELS) as well as energy-dispersive X-ray spectroscopy (EDXS) yield chemical, elemental as well as bonding information even down to the atomic scale. Additionally information about local band gaps and plasmonics are gained by monochromated low-loss EELS investigations. Furthermore, the Titan Themis3 300 is used to perform advanced in situ experiments using special TEM specimen holders. A further advanced method available at the Titan Themis3 300 is electron tomography enabling the analytical characterization of materials and devices in 3 dimensions. This high-end analytical TEM is used to answer the most complex questions regarding materials science.
- Emitter X-FEG
- High tension: 60-300 kV
- Monochromator, energy resolution 0.2 eV
- Cs probe corrector (CEOS, DCOR)
- Image-side Cs corrector (CEOS, CESCOR)
- Gatan imaging filter (GIF Quantum)
- HAADF detector for Z-contrast (Fishione)
- ADF/ABF/BF detectors (FEI)
- Videocamera (Flucam)
- 4k CMOS camera (Ceta 16M)
- High-efficiency Super-X detector (EDX)
- Tomography sample holder and software
- Special TEM holders (see below)
Thermo Fisher Scientific Spectra 200 C-FEG
The Spectra 200 provides high-resolution imaging as well as high-performance analytical investigation capabilities. This probe-corrected TEM enables high-resolution imaging in scanning TEM (STEM) mode for all high tensions between 30 kV and 200 kV. The ultra-high-brightness cold field emission gun (X-CFEG) with an energy resolution of < 0.4 eV in combination with a high-sensitivity SDD X-ray spectrometer (Super-X) and a high-resolution post-column energy loss spectrometer (Gatan Continuum S) creates a high-performance analytical instrument perfectly suited for the nanoanalytical characterization of all kinds of materials and devices. High-resolution electron energy-loss spectroscopy (EELS) as well as energy-dispersive X-ray spectroscopy (EDXS) yield chemical, elemental as well as bonding information even down to the atomic scale. Furthermore, the Spectra with its Ceta-S 4k high speed CMOS camera (up to 400 fps at binning 512) is used to perform advanced in situ experiments by making use of special TEM specimen holders available at CENEM. Moreover, in combination with simultaneous STEM imaging, the Spectra 200 allows for 4D-STEM investigations. A further advanced method available at the Spectra 200 is electron tomography enabling the analytical characterization of materials in three dimensions. This high-end analytical TEM enables to answer the most complex questions in almost all discipline of materials science and nanotechnology.
The most important specifications of the TFS Spectra 200 are:
- X-CFEG emitter
- High tension: 30-200kV
- Energy resolution < 0.4 eV
- Probe Cs corrector (CEOS S-CORR)
- Point resolution for STEM: 60 pm @ 200 kV, 125 pm @ 30 kV
- Gatan spectrometer (Gatan Continuum S)
- Super-X detector G2 (EDXS)
- BF, ADF STEM and iDPC imaging: 8 segmented BF and ADF detectors (16 segments in total)
- 4k CMOS camera
- Electron tomography functionality (including EDXS)
Philips CM30 TEM/STEM
- LaB6 cathode
- High tension: 150-300kV
- Twin objective lens (Cs = 2 mm)
- Point resolution (Scherzer): 0.23 nm
- 1k x 1k CCD camera (Tietz FastScan-F114)
- EDXS detector (Oxford)
- CL system (Oxford)
- Imaging Plates
SEM/FIB Dualbeam System
FEI Helios NanoLab 660
- Ultra-high resolution ElstarTM electron column with monochromator
- Resolution ~1 nm at 1-30 kV
- Retractable STEM and different SE & BSE detectors for advanced imaging contrasts
- High-resolution TomahawkTM ion column
- Gas Injection System for Pt, C and XeF2
- EasyLift NanoManipulator
- Kleindiek micromanipulator
- Oxford X-MaxN EDX detector (150 mm2 SDD)
- In-chamber plasma cleaner
TEM specimen holders
- Single tilt holders (FEI)
- Double tilt holders (FEI)
- Rotation holder (Philips)
- Vacuum transfer holder(Gatan)
- LN2 cooling holder (-170 °C) (Gatan)
- Helium cooling holder (-253 °C)
- Single tilt heating holder, MEMS based (DENSsolutions)
- Double tilt heating holder, MEMS based (DENSsolutions)
- Tomography holder (FEI)
- 360° Tomography holder (Fishione)
- PI 95 TEM PicoIndenter (Hysitron)
- TEM-STMTM holder (Nanofactory)
- TEM-AFMTM holder (Nanofactory)
Sample Preparation
- Ion Polishing Systems (2 Gatan PIPS, one with low-energy ion guns and LN2 cooling)
- Various grinding machines (Struers)
- Multiprep (Allied)
- Minimet (Bruehler)
- Wire Saw (Well)
- Dimpling machines (Gatan)
- Coating machine
- Evaporators
- Spin coater (Laurell)
- Cryo-ultramicrotome (Leica)
- Different ovens
- Various light microscopes (Zeiss with Leica CCD-camera)
- Stereo microscope (Leica M80)
- Plasma Cleaner (Fishione)
- Glove Box